Pixelated BIC metasurfaces for terahertz integrated sensing and imaging
用于太赫兹集成传感与成像的像素化BIC超表面
テラヘルツ統合センシングおよびイメージングのためのピクセル化BICメタサーフェス
테라헤르츠 통합 감지 및 이미징을 위한 픽셀화된 BIC 메타표면
Superficies metasuperficies BIC pixeladas para la detección e imagen integrada en el terahercio
Métasurfaces BIC pixélisées pour la détection et l'imagerie intégrées au térahertz
Пикселированные метаповерхности BIC для терагерцового интегрированного зондирования и визуализации
¹ State Key Laboratory of Optical Fiber and Cable Manufacture Technology, Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen 518055, China
中国 深圳 南方科技大学电子与电气工程系 光纤光缆先进制造与应用技术全国重点实验室
² China-UK Low Carbon College, Shanghai Jiao Tong University, Shanghai 200240, China
中国 上海 上海交通大学中英国际低碳学院
³ Guangdong Key Laboratory of Integrated Optoelectronics Intellisense, Southern University of Science and Technology, Shenzhen 518055, China
中国 深圳 南方科技大学 广东省集成光电子智感重点实验室
Conventional terahertz (THz) single-pixel imaging relies on a sequential process involving compressed sensing, which requires a spatial modulator and is often time-intensive. Here, we propose a new THz single-pixel imaging scheme operating in a parallelized fashion with a pixelated metasurface, demonstrated within a standard THz time-domain spectroscopy system.
This approach encodes spatial information through multiple narrow linewidth resonances based on bound states in the continuum (BIC) physics, and the BIC-enabled pixelated metasurface facilitates the near-field distributed sensing through local field enhancement. We validate this integrated imaging and sensing capability using a 2×2 metasurface array in a proof-of-concept experiment, with scalability to larger arrays.
The approach achieves 100% accuracy in binary imaging reconstruction from a single THz pulse and enables refractive index sensing with a sensitivity higher than 14.39 GHz/RIU. Leveraging the intrinsic penetration capability of THz radiation, this technique offers significant promise for next-generation noninvasive applications such as security inspection and defect detection in semiconductor chips and pharmaceutical products.
